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第三届电路、系统与器件国际会议(ICCSD 2019)

稿件来源:ICCSD 2019 责任编辑:ICAC 发布时间:2019-04-10
  2019年第三届电路、系统与器件国际会议【ICCSD 2019】将于2019年8月23日至25日在【中国成都】举行。会议由四川省电子学会,电子科技大学,东南大学,美国底特律大学支持,旨在为全世界科研学者、从业人员以及教育工作者提供一个最好的跨学科平台,探讨最近创新发明以及在电路设备与系统领域里面临的现实挑战与解决方法。我们诚挚地邀请您参与ICCSD 2019。

  ICCSD 2019大会接收并注册的全文将被收录到会议论文集中,由【EI核心与Scopus】等检索。

  *会议地点(暂定)成都西藏饭店地址: 成都人民北路一段10号

  *征稿主题(不限于以下) 请参考:http://iccds.org/call.html

  Circuits, devices and systems

  Smart grid and circuit

  Signal and multimedia processing

  Computers, software and applications

  Ocean engineering and marine technology

  Biomedical electronics and bioinformatics

  Communication engineering

  Electronics and electrical engineering

  Computer science applications

  Nano electro mechanical System

  Photonics and optoelectronics

  Networking, communication and multimedia

  Information engineering

  Wireless/Mobile communication and computing

  Software specification and software assurance

  Analysis of power quality and system stability

  Assembly and packaging

  Analog circuits and digital circuits

  Antenna and propagation

  Electric energy processing

  Electromagnetic and photonics

  Electro-optical phenomena of semiconductors

  Power electronics and energy systems

  Signal processing

  Techniques of laser and applications of electro-optics

  Simulation of propagation

  Battery management system

  Circuits and electronics

  Computer relaying integrated optics and electro-optics devices

  Microwave theory and techniques

  Microwave and millimeter

  Modulation, coding, and channel analysis

  Power electronics

  Remote control and techniques of GPS

  Robotics and atomization engineering

  Signal integrity design for high-speed digital systems

  Solar power generation

  Wind power generation

  Submission

  *投稿方式投稿系统:http://confsys.iconf.org/submission/iccsd2019 

  *联系我们会议秘书:罗女士邮箱: iccsd@academic.net 电话:+86 (0)28 8652-8629

  更多会议详情,请登陆 http://iccds.org/

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