| 论文编号: | 172511O120100091 |
| 第一作者所在部门: | 九室一组 |
| 论文题目: | 一种高密低成本交换ASIC封装的电学设计 |
| 论文题目英文: | |
| 作者: | 李君 |
| 论文出处: | |
| 刊物名称: | ICEPT-HDP |
| 年: | 2010 |
| 卷: | |
| 期: | |
| 页: | 548-551 |
| 联系作者: | |
| 收录类别: | |
| 影响因子: | 0 |
| 摘要: | A switch Application Specific Integrated Circuit (ASIC) chip implemented in six-substrate layers for low cost design which has more than 1000 pin-count. This paper deals with the electrical design of the high density package, including transmission characteristics of the key signal lines, crosstalk between signal lines, the coupling between neighboring power pins, DC IR drop and AC input impedance etc.. The authors used different local grounding solutions to reduce the current density and the coupling between power pins. In this paper, wide copper traces/shapes on the substrate layers were used to achieve minimum DC resistance and suppress the crosstalk between layers. Both wide copper traces/shapes and smallest available surface mount technology (SMT) capacitors placed at the bottom of the substrate were used to minimize the input impedance of power supply networks. Electrical test, DFT test and functional test showed that the low cost package meets the design requirements. |
| 英文摘要: | |
| 外单位作者单位: | |
| 备注: | ICEPT-HDP |
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