| 论文编号: | 172511O120100173 |
| 第一作者所在部门: | 九室一组 |
| 论文题目: | 基于交叉开关芯片以及多芯片组件封装技术的板内GHz光互连 |
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| 作者: | 刘丰满 |
| 论文出处: | EI收录 |
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| 年: | 2010 |
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| 影响因子: | 0 |
| 摘要: | High density, large bandwidth and lower power consumption link and switch inter-system is required. Shortdistance parallel optical link has become the hotspot of research because of its advantage compared with electrical link. Board communications have received a lot of attention. Most of the recent developments target 10Gbps-class systems such as super computers or high-speed IP switches. This paper demonstrates a complete short-distance parallel optical link on PCB-level based on optoelectronics multi-chip package structure for high-speed signal conversion and two cross-point chips integrated as switch used to complete signal crossassignment.Optoelectronic package modules we fabricated are 12-channel multi-chip modules based on an advanced coupling method with high coupling efficiency. The electrical problems related to signal integrity (SI) is discussed and some simulation results are showed. To demonstrate switch intersystem,two12-channel cross-point chips are placed on PCB board, signal can be reassigned to any output channel to complete 12-channel cross-switches. The ends of 12 fibers on the board are passively aligned with VCSEL and PD. The following sections present the system design as well as measurement results. |
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| 备注: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging |
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