| 论文编号: | 172511O120110053 |
| 论文题目: | 用于评估三维集成工艺的一款测试芯片的设计和制造 |
| 刊物名称: | 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) |
| 年: | 2011 |
| 页: | 1764 |
| 联系作者: | 宋崇申 |
| 备注: | Electronic Components and Technology Conference (ECTC) |
| 论文编号: | 172511O120110053 |
| 论文题目: | 用于评估三维集成工艺的一款测试芯片的设计和制造 |
| 刊物名称: | 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) |
| 年: | 2011 |
| 页: | 1764 |
| 联系作者: | 宋崇申 |
| 备注: | Electronic Components and Technology Conference (ECTC) |
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