| 论文编号: | 172511O120110317 |
| 第一作者所在部门: | 九室一组 |
| 论文题目: | 用于三维MEMS封装的钨通孔互连玻璃基板的研发 |
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| 作者: | 孙瑜 |
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| 刊物名称: | 13th Electronics Packaging Technology Conference（EPTC 2011） |
| 年: | 2011-12-07 |
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| 联系作者: | 孙瑜 |
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| 摘要: | As the development of electronic devices, three-dimensional (3D) integration is the next generation of electrical packaging technique. Glass is another excellent material for packaging with lots of advantages. In this paper, we introduce novel tungsten filled through glass via wafer, simulated electronic characters and its application on MEMS. |
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