| 论文编号: | 172511O120120094 |
| 第一作者所在部门: | 九室一组 |
| 论文题目: | 焊料包铜球填充法实现高频硅通孔填充 |
| 论文题目英文: | |
| 作者: | 于大全 |
| 论文出处: | |
| 刊物名称: | Journal of semiconductors |
| 年: | 2012 |
| 卷: | |
| 期: | 33 |
| 页: | 086002-1 |
| 联系作者: | 于大全 |
| 收录类别: | |
| 影响因子: | 0.3209 |
| 摘要: | A novel low-cost and high-speed via filling method using Cu-cored solder balls was investigated for through-silicon via manufacture.Cu-cored solder balls with a total diameter of 100 μm were used to fill 150 μm deep,110 μm wide vias in silicon.The wafer-level filling process can be completed in a few seconds,which is much faster than using the traditional electroplating process.Thermo-mechanical analysis of via filling using solder,Cu and Cu-cored solder was carried out to assess the thermo-mechanical properties of the different filling materials.It was found that the vias filled with Cu-cored solder exhibit less thermal-mechanical stresses than solder-filled vias,but more than Cu-filled vias. |
| 英文摘要: | |
| 外单位作者单位: | |
| 备注: | EI收录 |
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