| 论文编号: | 172511O120130159 |
| 第一作者所在部门: | |
| 论文题目: | 一种新型的叠层封装堆叠结构 |
| 论文题目英文: | |
| 作者: | 孙晓峰 |
| 论文出处: | |
| 刊物名称: | 2013 14th International Conference on Electronic Packaging Technology |
| 年: | 2013-08-13 |
| 卷: | |
| 期: | 2013 |
| 页: | 34 |
| 联系作者: | 孙晓峰 |
| 收录类别: | |
| 影响因子: | |
| 摘要: | In this paper a four-layer package-on-package(PoP) stacking structure was introduced which allowed the whole package using fine pitch solder ball and consequently improved the interconnection I/O density between the neighboring packages. |
| 英文摘要: | |
| 外单位作者单位: | |
| 备注: | |
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