论文编号: 172511O120130103
第一作者所在部门:
论文题目: NA
论文题目英文:
作者: 蒋文静
论文出处:
刊物名称: JOURNAL OF MICROMECHANICS AND MICROENGINEERING
: 2013-03-29
:
: 23
: 65004
联系作者: 蒋文静
收录类别:
影响因子:
摘要: A new concept for uncooled infrared (IR) imaging with a high fill-factor SOI diode structure has been proposed. This approach has the potential of reaching a noise equivalent temperature difference (NETD) in the milli-Kelvin range. This detector makes the IR absorbing structure cover almost the entire pixel area, in which the fill factor can reach 80%. Using the multilever structure, thermal isolation can be independently optimized without sacrificing the IR absorption area. The analysis shows that this high fill-factor SOI diode uncooled IR focal plane array can be made without failure of structure breakdown or buckling. The design shows that the sensitivity is of 7.75 × 10?3 V K?1, and the NETD is of 42 mK (f/1.0, 30Hz) which can be achieved in a 35 μm × 35 μm micromachined structure.
英文摘要:
外单位作者单位:
备注: