| 论文编号: | 1725110120160015 |
| 第一作者所在部门: | 封装中心 |
| 论文题目: | Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via（TGV）applications |
| 刊物名称: | Microsyst Technol |
| 年: | 2015 |
| 卷: | 22 |
| 期: | 1 |
| 页: | 1-9 |
| 联系作者: | 林来存 |
| 影响因子: | 0.875 |
| 论文编号: | 1725110120160015 |
| 第一作者所在部门: | 封装中心 |
| 论文题目: | Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via（TGV）applications |
| 刊物名称: | Microsyst Technol |
| 年: | 2015 |
| 卷: | 22 |
| 期: | 1 |
| 页: | 1-9 |
| 联系作者: | 林来存 |
| 影响因子: | 0.875 |
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