| 论文编号: | 1725110120160352 |
| 论文题目: | A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique |
| 作者: | 徐杨 |
| 刊物名称: | Proceedings of 2016 International Conference on Solid-State and Integrated Circuit Technology |
| 年: | 2016 |
| 期: | 1 |
| 页: | S16-4 |
| 联系作者: | 王盛凯 |
科研产出