| 论文编号: | 1725110120160352 |
| 第一作者所在部门: | |
| 论文题目: | A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique |
| 论文题目英文: | |
| 作者: | 徐杨 |
| 论文出处: | |
| 刊物名称: | Proceedings of 2016 International Conference on Solid-State and Integrated Circuit Technology |
| 年: | 2016 |
| 卷: | |
| 期: | 1 |
| 页: | S16-4 |
| 联系作者: | 王盛凯 |
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| 影响因子: | |
| 摘要: | |
| 英文摘要: | |
| 外单位作者单位: | |
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科研产出