| 论文编号: | 1725110120160132 |
| 论文题目: | Transient Electro-Thermal Coupling Analysis in Through-Silicon-Via Using Proper Orthogonal Decomposition |
| 刊物名称: | proceedings |
| 年: | 2016 |
| 期: | 1 |
| 页: | 1 |
| 联系作者: | 徐小宇 |
| 论文编号: | 1725110120160132 |
| 论文题目: | Transient Electro-Thermal Coupling Analysis in Through-Silicon-Via Using Proper Orthogonal Decomposition |
| 刊物名称: | proceedings |
| 年: | 2016 |
| 期: | 1 |
| 页: | 1 |
| 联系作者: | 徐小宇 |
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