2021年12月，承担 中国科学院特别研究助理择优支助项目-大功率射频微系统三维异质集成与近结高效冷却技术

2022年1月，承担 国家自然科学基金青年项目-基于微流道晶圆重构的三维集成芯片冷却关键技术研究

2024年1月，承担国家自然科学基金“集成芯片前沿技术科学基础”重大研究计划培育项目-面向集成芯片万瓦级散热的膜基薄液膜沸腾关键技术研究

2021年7月，参与北方集成电路技术创新中心(北京)有限公司合作项目-Chiplet三维封装大功率热点的一体化微流道冷却技术

2021年11月，参与中国科学院先导A类项目

[1] Chen C, Hou F, Su M, et al. Pressure Drop and Thermal Characteristic Prediction for Staggered Strip Fin Microchannel[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(3): 435-443. (SCI，IF=1.89)

[2] Chen C, Su M, Ma R, et al. Analytical Assessment of the Effect of Thermal Interface Layer Voids on Temperature in Lid-Integral Microchannel Coldplate Cooling[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(6): 1000-1009. (SCI，IF=1.89)

[3] Chen C , Hou F , Ma R , et al. Design, Integration and Performance Analysis of a Lid-Integral Microchannel Cooling Module for High-Power Chip[J]. Applied Thermal Engineering, 2021(8):117457. (SCI，IF=5.295)

[4] Chen C, Su M, Ma R, et al. Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process[J]. Materials. 2022, 15(5). (SCI，IF=3.748)

[5] Song Y, Fu R, Chen C*, et al. Case-embedded Cooling for High Heat Flux Microwave Multi-chip Array[J]. Applied Thermal Engineering, 2022:118852. (SCI，IF=6.465)

[6] Liu D, Chen C*, Su M, et al. Hygro-thermal Analysis of Embedded Device Package in Reflow Process[C]. Electronics System-Integration Technology Conferences, Sibiu, Romania, 13-16 Sept. 2022.

[7]Song Y, Chen C*, Wang Q, et al. Comparison of Different Cooling Schemes for AlGaN/GaN HEMTs[J]. Micromachines, 2024, 15(1): 33. (SCI，IF=3.4)

[8]Zhang Y*, Zhao C, Yu C, Li Y,  Guo Y, Zhang Y, Chen C*, Cao L. High-linearity Graphene-based Temperature Sensor Fabricated by Laser Writing[J]. Journal of Materials Science: Materials in Electronics, 2024, 35(2): 109. (SCI，IF=2.22)

[9] Chen H; Chen C.; Zhou Y, et al. Evaluation and Optimization of a Cross-Rib Micro-Channel Heat Sink[J]. Micromachines. 2022, 13(1):132. (SCI，IF=3.523)

[10] Hou F, Wang W, Zhang H, Chen C, et al, Experimental evaluation of a coMPact two-phase cooling system for high heat flux electronic packages[J], Applied Thermal Engineering, 2019, 163, No. 114338. . (SCI，IF=5.295)