教育背景

2017.12-2020.06  荷兰代尔夫特理工大学，微电子系，博士

工作简历

2021.07-今，中国科学院微电子研究所，系统封装与集成研发中心，副研究员

2016.01-2021.06，中国科学院微电子研究所，系统封装与集成研发中心，助理研究员；

2012.07-2015.12, 中国科学院微电子研究所, 系统封装与集成研发中心, 研究实习员

在TPEL、ATE、TED等学科顶刊和顶会上发表论文60余篇

[1] Fengze Hou, Hengyun Zhang, Dezhu Huang, Jiajie Fan, Fengman Liu, Tingyu Lin, Liqiang Cao, Xuejun Fan, Braham Ferreira, G.Q. Zhang, Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm² Heat Dissipation, IEEE Transactions on Power Electronics, 2020, 35(10): 10592-10600.

[2]X. Sun, M. Chen*, B. Li, F Hou*, et al., ”Design and Evaluation of a Face-down Embedded SiC Power Module with Low Parasitic Inductance and Low Thermal Resistance,” IEEE Transactions on Power Electronics, vol. 38, no. 3, pp. 2799-2804, 2023.

[3] Fengze Hou, Wenbo Wang, Rui Ma, Yonghao Li, Zhonglin Han, Meiying Su, Jun Li, Zhongyao Yu, Yang Song, Qidong Wang, Min Chen, Liqiang Cao, Guoqi Zhang, Braham Ferreira, Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging, IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020, 8(1): 367-380.

[4] Fengze Hou, Wenbo Wang, Liqiang Cao, Jun Li, Meiying Su, Tingyu Lin, Guoqi Zhang, Braham Ferreira, Review of Packaging Schemes for Power Module, IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020, 8(1): 223-238.

[5] Yichen Qian, Fengze Hou, Jiajie Fan, Quanya Lv, Xuejun Fan, Guoqi Zhang, Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network, IEEE Transactions on Electron Devices, 2021, 68: 3460-3467.

[6] Fengze Hou, Wenbo Wang, Tingyu Lin, Liqiang Cao, Guoqi Zhang, J. A. Ferreira, Characterization of PCB Embedded Package Materials for SiC MOSFETs, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(6): 1054-1061.

[7] Fengze Hou, Wenbo Wang, Hengyun Zhang, Cheng Chen, Chuan Chen, Tingyu Lin, Liqiang Cao, G.Q. Zhang, J.A. Ferreira, Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages, Applied Thermal Engineering, 2019, 163: 114338.

[8] Fengze Hou, Tingyu Lin, Liqiang Cao, Fengman Liu, Jun Li, Xuejun Fan, Guoqi Zhang, Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(10): 1721-1728.

[9] Chuan Chen, Fengze Hou, Rui Ma, Meiying Su, Jun Li, Liqiang Cao, Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip, Applied Thermal Engineering, 2021, 198: 117457.

[10] Fengze Hou, Xueping Guo, Qidong Wang, Wenbo Wang, Tingyu Lin, Liqiang Cao, Guoqi Zhang, J.A. Ferreira, High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology, IEEE Electronic Components and Technology Conference, CA, 2018, pp. 1365- 1370.

[11] Fengze Hou, Yunyan Zhou, Fengman Liu, Meiying Su, Cheng Chen, Jun Li, Tingyu Lin, Liqiang Cao, Optimization Design of 2.5D TSV Package Using Thermo-electrical Co-simulation Method, IEEE Electronic Components and Technology Conference, Las Vegas, NV, 2016, pp. 1964-1969.

授权24项中国和美国专利

[1]Fengze Hou, Tingyu Lin. Heat dissipation solution for advanced chip packages, US9653378B2.

[2]侯峰泽, 陈钏, 通过微流道散热的器件封装结构及其制作方法, CN109119392B.

[3]侯峰泽, 曹立强, 陈钏, 马瑞, 苏梅英, 一种半导体器件散热模块及电子装置, CN112768418B.

[4]侯峰泽. 一种制作刚柔结合板的三维封装散热结构的方法, CN103594433A.

[5]侯峰泽, 邱德龙. 一种刚柔结合板的三维封装散热结构, CN103594432A.

[6]侯峰泽, 苏梅英, 徐成. 一种基于载体的扇出2.5D/3D封装结构, CN105428260B.

[7]侯峰泽, 林挺宇. 用于倒装焊大功率芯片BGA封装的散热结构, CN104112726B.

[8]侯峰泽, 林挺宇. 用于大功率逻辑芯片PoP封装的散热结构, CN104134637A.

[9]侯峰泽, 林挺宇. 用于大功率芯片BGA封装的散热结构, CN104112725B.

[10]侯峰泽, 刘丰满, 李君.一种用于PoP封装的散热结构, CN103560117B.