| 论文编号: | 172511O120120301 |
| 第一作者所在部门: | 九室一组 |
| 论文题目: | 基于PCB埋入无源器件的设计和仿真 |
| 论文题目英文: | |
| 作者: | zhangjing |
| 论文出处: | |
| 刊物名称: | ICEPT |
| 年: | 2012 |
| 卷: | |
| 期: | 13 |
| 页: | 1 |
| 联系作者: | zhangjing |
| 收录类别: | |
| 影响因子: | |
| 摘要: | Embedded passives are becoming increasingly important for next generation miniaturized systems. A Printed Circuit Boards is investigated in this paper with focus on Passive Devices. Film resistance, capacitance and inductance and embedded into the same board. The effects of embedded capacitors and inductance on SI (Signal integrity) and EMC (Electro Magnetic Compatibility) has been simulated and measured, compared with measured results using conventional discrete capacitors. A finite element, full-wave method was used to simulate and analyze the transmission characteristics |
| 英文摘要: | |
| 外单位作者单位: | |
| 备注: | EI收录 |
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