| 论文编号: | 172511O120120129 |
| 第一作者所在部门: | 九室一组 |
| 论文题目: | 采用复合焊料结合进行低温圆片级气密键合的研究 |
| 论文题目英文: | |
| 作者: | 于大全 |
| 论文出处: | |
| 刊物名称: | Microelectronics Reliability |
| 年: | 2012 |
| 卷: | 52 |
| 期: | 3 |
| 页: | 589 |
| 联系作者: | 于大全 |
| 收录类别: | |
| 影响因子: | 0 |
| 摘要: | A reliable composite metal seal comprising both intermetallic compounds (IMC) and solder joints, which are formed by transient liquid phase bonding and soldering respectively, is proposed and demonstrated in wafer level bonding experiments. Hermetic sealing is demonstrated on 8-in, wafers using low volume Cu/Sn materials at process temperatures as low as 280 degrees C. It is shown that the composite seal is stable when subjected to temperatures of 250 degrees C, and that it provides better hermeticity and reliability than an IMC seal alone. (C) 2011 Elsevier Ltd. All rights reserved. |
| 英文摘要: | |
| 外单位作者单位: | |
| 备注: | SCI收录 |
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