教育背景
2018.9~2022.7，中国科学院大学 博士研究生
工作简历
2015.10~2018.3 中国科学院微电子研究所 研究实习员
2018.4~2023.11 中国科学院微电子研究所 助理研究员
2023.12至今 中国科学院微电子研究所 副研究员微系统先进散热技术
作为课题负责人/技术骨干参与多个重大、重点专项的科研任务
1. Ye, Yuxin, Liu Ruiwen, Du, Xiangbin, Zhang Nan, Kong Yanmei, Jiao Binbin, Chen Dapeng. Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation[J]. Applied thermal engineering: Design, processes, equipment, economics, 2021, 195(1).
2. Ye Y, Jiao B, Kong Y, et al. Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling[J]. Applied Thermal Engineering, 2022, 202: 117849.
3. Cong B, Kong Y, Ye Y, et al. A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control[J]. Applied Thermal Engineering, 2023, 219: 119370.
4. Zhang N, Jiao B, Ye Y, et al. Embedded cooling method with configurability and replaceability for multi-chip electronic devices[J]. Energy Conversion and Management, 2022, 253: 115124.
5. Ye Y, Wu M, Kong Y, et al. Active thermal management of GaN-on-SiC HEMT with embedded microfluidic cooling[J]. IEEE Transactions on Electron Devices, 2022, 69(10): 5470-5475.
6. Lu D, Ye Y, Liu R, et al. Near-Junction Thermal Management of GaN-on-SiC MMIC Power Amplifier Through Substrate Embedded Microchannel[J]. IEEE Transactions on Electron Devices, 2023.
7. Ye Y, Du X, et al. Experimental Investigations on Thermal Superposition Effect by Embedded Manifold Cooling[C]//2023 25th IEEE Electronics Packaging Technology Conference（IEEE EPTC）.
8. Ye Y, Lu G, Meng X, et al. Evaluation of Mobile Data Center Cooling Performance Based on Embedded Cooling[C].// 2024 IEEE 23rd Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE ITherm).
9. Ye Y, Yun,S, Liu R, et al. Application of Silicon Piezoresistive Effect In MEMS Embedded Microlfuidic Cooling[C].// 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems (IEEE MEMS).
10. Zhang N, Ye Y, Liu Q, et al. Embedded microchannel cooler with manifold for IC chips[C]//2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (IEEE MEMS).
已授权专利：
1. 叶雨欣,焦斌斌,孔延梅,陈大鹏. 自适应散热装置. ZL 202022031889.3.
2. 叶雨欣,焦斌斌,孔延梅,刘瑞文,陈大鹏. 热电集成散热模块. ZL 202110234809.0.
3. 叶雨欣,焦斌斌,孔延梅,刘瑞文,陈大鹏. 热管理监控模块. ZL 202110234811.8
4. 焦斌斌,叶雨欣,孔延梅. 电子芯片及电子器件. ZL 202010658241.0
5. 孔延梅,张楠,焦斌斌,刘瑞文,叶雨欣,刘文宝. 一种多热源散热冷却装置以及冷却方法. ZL202110218038.6.
6. 焦斌斌,孔延梅,云世昌,叶雨欣,陈大鹏. 封闭结构、其制作方法与器件. ZL 201810553113.2.
7. 王渊,焦斌斌,叶雨欣,孔延梅,陈大鹏. 流量信号的补偿方法、装置、存储介质、处理器和系统. ZL201910299977.0
8. 焦斌斌,刘瑞文,云世昌,孔延梅,叶雨欣,杜向斌. 一种多传感器组合结构及其加工方法、组合传感器.ZL202210483866.7
1. 2022年获中国仪器仪表学会科技进步一等奖（排名13）。
2. IEEE-NEMS 2021会议最佳论文奖。
3. IEEE ICEPT 2022会议最佳论文奖。
4. 中国科学院微电子研究所2022年度先进工作者。
人才队伍