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论文题目	作者	刊物名称	发表年度
Investigation of thermal characteristics and two-phase flows of a star-shape thin heat pipe	;	Applied Thermal Engineering	2016
An electrical test method for quality detecting of wafer level eutectic bonding	张乐民;	Journal of Micromechanics and Microengineering	2016
采用亚像素缝雕刻的图像整形算法	杨博;	计算机辅助设计与图形学学报	2016
长期日常血压监测及日常行为干预对高血压控制的影响	;	心血管病防治知识	2016
Band40波段体声波滤波器的设计	韩茜茜;	微纳电子技术	2016
Simulation and fabrication of thin film bulk acoustic wave resonator	韩茜茜;	Journal of Semiconductors	2016
A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology	欧毅;	Applied Physics Letters	2016
基于PNN的网联汽车前方碰撞预警系统研究	;	2016中国汽车工程学会年会论文集	2016
An All-Digital On-Chip Clock Generator Using Relative Reference Modeling	赵慧冬;	The 2016 IEEE International Symposium on Radio-Frequency Integration Technology	2016
Layout Decomposition Algorithms for Double Patterning Lithography	张学连;	ICSICT-2016	2016
体域网基带验证平台设计与实现	吴开斌;	电子技术应用	2016
Nanoforest of black silicon fabricated by AIC and RIE method	;	Materials Letters	2016
SAPTL –based Robust Sub-threshold Adder Circuit Design	张琦;	ICSICT-2016	2016
Turbocharging the channel	;	Copyright Compound Semiconductor	2016
A Combined Wafer Bonding Method using Spin-coated Water Glass Adhesive Layer and Spot Pressing Bonding Technique	徐杨;	IEEE	2016