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  • 姓名: 柴俊帅
  • 性别: 男
  • 职称: 副研究员
  • 职务: 
  • 学历: 博士研究生
  • 电话: 18801498130
  • 传真: 
  • 电子邮件: chaijunshuai@ime.ac.cn
  • 所属部门: 集成电路先导工艺研发中心
  • 通讯地址: 北京市朝阳区北土城西路3号

    简  历:

  • 教育背景

    2017.9~2020.9   中国科学院物理研究所         博士

    2014.9~2017.6    四川大学                     硕士

    工作简历

    2023.4~至今      中国科学院微电子研究所      副研究员     

    2020.10~2023.3    中国科学院微电子研究所      博士后


    社会任职:

  • 担任本领域权威期刊IEEE EDL/TED/TDMR、APL、Science China、ACS AMI等审稿人

    研究方向:

  • 铪基铁电闪存器件及集成技术研究

    承担科研项目情况:

  • 1. 国自然重点项目:新型三维硅基铁电场效应晶体管存储器关键问题与集成技术研究,2026.1-2030.12,项目骨干

    2. 中科院先导A项目,2022.11-2025.10,课题级核心骨干

    3. 中国博士后科学基金第69批面上项目:HfZrO铁电晶体管基于栅结构原子分布调控的栅缺陷钝化方法研究,2021.07-2023.03,项目负责人

    4. 国家重点实验室自主部署项目:面向3D NAND闪存应用的铪基FeFET存储窗口提升机制研究,2024.1-2024.12,项目负责人

    5. 国自然重点研发计划培育项目:硅沟道铪基铁电FeFET的疲劳特性提升方法的研究,2023.1-2025.12,主要参与者


    代表论著:

  • Researchgate链接:

    https://www.researchgate.net/profile/Jun-Shuai-Chai-2?ev=hdr_xprf

    [1] Runhao Han, Jia Yang, Tao Hu, Mingkai Bai, Yajing Ding1, Xianzhou Shao, Wenliang Liu*, Junshuai Chai*, Hao Xu*, Xiaolei Wang, Wenwu Wang and Tianchun Ye, Gate/Channel Interface Co-design for Highly Reliable 3D FE NAND, 2026 IEEE International Reliability Physics Symposium (IRPS)

    [2] Runhao Han, Tao Hu, Jia Yang, Saifei Dai, Yajing Ding, Mingkai Bai, Xianzhou Shao*, Junshuai Chai*, Hao Xu, Qing Luo, Wenwu Wang, Tianchun Ye, Xiaolei Wang, Unveiling Retention Loss Mechanism in FeFETs With Gate-Side Interlayer by Decoupling Trapped Charges and Ferroelectric Polarization, IEEE Transactions on Electron Devices, vol. 73, pp. 3580-3586 (2026)

    [3] H. Run, J. Chai*, T. Hu, J. Yang, T. Luo, X. Shao, M. Liao*, X. Sun, Y. Du, W. Liu*, K. Han, H. Xu, Q. Luo, X. Wang, W. Wang, T. Ye, "Interlayer Co-Design Enabling a Large Memory Window and Robust Reliability in Ferroelectric Vertical Gate-All-Around FETs," IEEE Electron Device Letters, Early Access (2026)

    [4] H. Xu, S. Dai, X. Shao, M. Liao, Z. Chen, T. Hu, R. Han, J. Yang, Y. Ding, Y. Zhao, P. Jia, X. Sun, J. Chai, X. Wang, W. Wang, "The Vth shift mechanism in MIFIS FeFET: A field-driven perspective," Applied Physics Letters, vol. 127, pp. 162901 (2025)

    [5] X. Shao, J. Chai*, F. Tian, X. Ke, M. Liao, S. Dai, H. Fan, X. Sun, H. Xu, K. Han, J. Xiang, X. Wang*, J. Zhang, W. Wang, and T. Ye, "Evidence of Oxygen Vacancy Generation as Physical Origin of Endurance Fatigue of Si FeFET With TiN/Hf0.5Zr0.5O2/SiOx/Si Gate-Stacks," IEEE Transactions on Electron Devices, vol. 71, pp. 7461-7469 (2024)

    [6] S. Dai, J. Chai*, J. Duan, J. Xiang, K. Han, Y. Wang, H. Xu*, J. Zhang, X. Wang, and W. Wang, "Investigation of Hf0.5Zr0.5O2 Ferroelectric Films at Low Thermal Budget (300 ℃)," IEEE Transactions on Electron Devices, vol. 71, pp. 5150-5155 (2024)

    [7] M. Liao, J. Chai*, J. Xiang, K. Han, Y. Wang, H. Xu, X. Wang*, J. Zhang, and W. Wang, "Wake-Up Free Hf0.5Zr0.5O2 Ferroelectric Capacitor by Annealing and Inserting a Top Dielectric Layer," IEEE Transactions on Electron Devices, vol. 71, pp. 6022-6026 (2024)

    [8] T. Hu, X. Shao, M. Bai, X. Jia, S. Dai, X. Sun, R. Han, J. Yang, X. Ke, F. Tian, S. Yang, J. Chai*, X. Hao, X. Wang, W. Wang*, and T. Ye, "Impact of Top SiO2 Interlayer Thickness on Memory Window of Si Channel FeFET With TiN/SiO2/Hf0.5Zr0.5O2/SiO2/Si (MIFIS) Gate Structure," IEEE Transactions on Electron Devices, vol. 71, pp. 6698-6750 (2024)

    [9] S. Dai, S. Li, S. Xu, F. Tian, J.Chai, * J. Duan, W. Xiong, J. Xiang, K. Han, Y. Wang, H. Xu*, J. Zhang, X. Wang, and W. Wang, "Role of Nitrogen in Suppressing Interfacial States Generation and Improving Endurance in Ferroelectric Field-Effect Transistors," IEEE Transactions on Electron Devices, vol. 71, pp. 5081-5088 (2024)

    [10] F. Tian, X. Sun, S. Li, S. Xu,J. Chai*, J. Xiang, K. Han, Y. Wang, H. Xu*, J. Zhang, X. Wang*, and W. Wang, "Investigation of Trap Evolution of Hf0.5Zr0.5O2 FeFET During Endurance Fatigue by Gate Leakage Current," IEEE Transactions on Electron Devices, vol. 71, pp. 1040-1047 (2023)

    [11] J. Chai, H. Xu, J. Xiang*, Y. Zhang, S. Zhao, F. Tian, J. Duan, K. Han, X. Wang, J. Luo, W. Wang* and T. Ye, "Endurance Improvement of Si FeFET by a Fully CMOS-Compatible Process: Insertion of HfOx at Hf0.5Zr0.5O2/SiOx Interface to Suppress Oxygen Vacancy Generation," IEEE Transactions on Electron Devices, vol. 69, no. 12, pp. 7156-7160 (2022)

    [12] J. Chai, H. Xu, J. Xiang, Y. Zhang, L. Zhou, S. Zhao, F. Tian, J. Duan, K. Han, X. Wang, J. Luo, W. Wang, T. Ye, and Y. Guo, "First-principles study of oxygen vacancy defects in orthorhombic Hf0.5Zr0.5O2/SiO2/Si gate stack," Journal of Applied Physics, vol. 132, no. 10, (2022)

    [13] S. Zhao, F. Tian, H. Xu*, J. Xiang*, T. Li, J. Chai*, J. Duan, K. Han, X. Wang, and W. Wang, "Experimental extraction and simulation of charge trapping during endurance of FeFET with TiN/HfZrO/SiO2/Si (MFIS) gate structure," IEEE Transactions on Electron Devices, vol. 69, no. 3, pp. 1561-1567 (2022)

    [14] J. Chai, G. Yang, J. Xu, W. Wang, L. Xu, J. Wang, La induced Si3 trimer bilayer on Si(111) surface, Physical Chemistry Chemical Physics, vol. 23, pp. 11466-11471 (2021)

    [15] J. Chai, W. Wang, L. Xu, Mn-Doped Sr/Si(111)-(3 × 2) HCC Surfaces: Antiferromagnetic Semiconductors for Spintronic Applications, ACS Applied Materials & Interfaces, vol. 12,  pp. 9918-9924 (2020)

    [16] J. Chai, X. Zhu, J. Wang, Structural and electronic properties of BaSi2(100) thin film on Si(111) substrate, Journal of Materials Science, vol. 55, pp. 9483–9492 (2020)

    [17] J. Chai, W. Wang, L. Xu, Structural stability and electronic properties of Sr induced (5×4) reconstruction on Si(111) surface, Physics Letters A, vol. 384, pp. 126540 (2020)

    专利申请:

    获奖及荣誉:

  • 1.2022年入选北京市科学技术协会“2023-2025年青年人才托举工程”项目

    2.2024年入选中国科学院微电子研究所“青苗计划”A类人才项目